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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Jeremiah Gayle / Joshua Ravich / Juan Cepeda-Rizo

82,44 €
IVA incluido
Disponible
Editorial:
Taylor & Francis Ltd
Año de edición:
2024
Materia
Ingeniería mecánica
ISBN:
9781032160856
82,44 €
IVA incluido
Disponible

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Sobre IBD

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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